5962-8855501FA
vs
5962-8855501FX
feature comparison
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
TELEDYNE E2V (UK) LTD
|
QP SEMICONDUCTOR INC
|
| Part Package Code |
DFP
|
|
| Package Description |
DFP, FL16,.3
|
|
| Pin Count |
16
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
WITH HOLD MODE
|
WITH HOLD MODE
|
| Family |
F/FAST
|
F/FAST
|
| JESD-30 Code |
R-GDFP-F16
|
R-GDFP-F16
|
| JESD-609 Code |
e0
|
|
| Length |
9.6645 mm
|
9.6645 mm
|
| Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
| Max Frequency@Nom-Sup |
60000000 Hz
|
|
| Max I(ol) |
0.02 A
|
|
| Number of Bits |
6
|
6
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DFP
|
DFP
|
| Package Equivalence Code |
FL16,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Power Supply Current-Max (ICC) |
45 mA
|
|
| Propagation Delay (tpd) |
10.5 ns
|
10.5 ns
|
| Qualification Status |
Qualified
|
Not Qualified
|
| Screening Level |
MIL-STD-883
|
|
| Seated Height-Max |
2.032 mm
|
2.032 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
TTL
|
TTL
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
FLAT
|
FLAT
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
| Width |
6.604 mm
|
6.604 mm
|
| fmax-Min |
70 MHz
|
70 MHz
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare 5962-8855501FA with alternatives
Compare 5962-8855501FX with alternatives