5962-8855210NA
vs
AS8S512K32Q1-55L/883
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
TELEDYNE E2V (UK) LTD
MICROSS COMPONENTS
Part Package Code
DFP
Package Description
DFP, FL28,.4
QFP,
Pin Count
28
Reach Compliance Code
compliant
compliant
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
20 ns
55 ns
I/O Type
COMMON
JESD-30 Code
R-GDFP-F28
S-CQFP-G68
JESD-609 Code
e0
Memory Density
262144 bit
16777216 bit
Memory IC Type
STANDARD SRAM
SRAM MODULE
Memory Width
8
32
Number of Functions
1
1
Number of Terminals
28
68
Number of Words
32768 words
524288 words
Number of Words Code
32000
512000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
32KX8
512KX32
Output Characteristics
3-STATE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, METAL-SEALED COFIRED
Package Code
DFP
QFP
Package Equivalence Code
FL28,.4
Package Shape
RECTANGULAR
SQUARE
Package Style
FLATPACK
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Qualified
Screening Level
MIL-PRF-38535
MIL-STD-883
Standby Current-Max
0.00075 A
Standby Voltage-Min
2 V
Supply Current-Max
0.15 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
FLAT
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
QUAD
Base Number Matches
3
1
Length
22.352 mm
Seated Height-Max
5.08 mm
Width
22.352 mm
Compare 5962-8855210NA with alternatives
Compare AS8S512K32Q1-55L/883 with alternatives