5962-8855208XX
vs
P4C164-70L32CLF
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
PYRAMID SEMICONDUCTOR CORP
Part Package Code
DIP
QFJ
Package Description
DIP,
QCCN,
Pin Count
28
32
Reach Compliance Code
unknown
compliant
ECCN Code
3A001.A.2.C
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
55 ns
70 ns
Additional Feature
TTL COMPATIBLE INPUT/OUTPUT; BATTERY BACKUP; LOW POWER STANDBY
JESD-30 Code
R-CDIP-T28
R-CQCC-N32
JESD-609 Code
e0
Memory Density
262144 bit
65536 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
32
Number of Words
32768 words
8192 words
Number of Words Code
32000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Organization
32KX8
8KX8
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
QCCN
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Screening Level
MIL-STD-883
Seated Height-Max
5.8928 mm
1.905 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
NO LEAD
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
QUAD
Width
7.62 mm
11.43 mm
Base Number Matches
1
1
Rohs Code
Length
13.97 mm
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Current-Max
0.13 mA
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare 5962-8855208XX with alternatives
Compare P4C164-70L32CLF with alternatives