5962-8855205XA vs 5962-8855205XX feature comparison

5962-8855205XA Micross Components

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5962-8855205XX Integrated Device Technology Inc

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer MICROSS COMPONENTS INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code DIP DIP
Package Description DIP, DIP28,.6 DIP,
Pin Count 28 28
Reach Compliance Code compliant unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Factory Lead Time 8 Weeks
Access Time-Max 35 ns 35 ns
I/O Type COMMON
JESD-30 Code R-GDIP-T28 R-CDIP-T28
JESD-609 Code e0 e0
Memory Density 262144 bit 262144 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 32KX8 32KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Equivalence Code DIP28,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 MIL-STD-883
Standby Current-Max 0.00035 A
Standby Voltage-Min 2 V
Supply Current-Max 0.145 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 5 7
Additional Feature TTL COMPATIBLE INPUT/OUTPUT; BATTERY BACKUP; LOW POWER STANDBY
Seated Height-Max 5.8928 mm
Width 7.62 mm

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Compare 5962-8855205XX with alternatives