5962-8855204NX
vs
5962-8866204MC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
PYRAMID SEMICONDUCTOR CORP
LOGIC DEVICES INC
Package Description
DFP,
DFP,
Reach Compliance Code
compliant
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
45 ns
45 ns
JESD-30 Code
R-GDFP-F28
Length
18.288 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
32KX8
32KX8
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DFP
DFP
Package Shape
RECTANGULAR
Package Style
FLATPACK
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883 Class B (Modified)
MIL-PRF-38535
Seated Height-Max
2.921 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
FLAT
FLAT
Terminal Pitch
1.27 mm
Terminal Position
DUAL
DUAL
Width
12.446 mm
Base Number Matches
4
1
Part Package Code
DFP
Pin Count
28
JESD-609 Code
e0
Terminal Finish
TIN LEAD
Compare 5962-8855204NX with alternatives
Compare 5962-8866204MC with alternatives