5962-8854701QX
vs
5962-8944903QX
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
INTEL CORP
Part Package Code
DIP
DIP
Package Description
DIP,
DIP,
Pin Count
40
40
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
20
Boundary Scan
NO
NO
Clock Frequency-Max
8 MHz
16 MHz
External Data Bus Width
16
16
JESD-30 Code
R-CDIP-T40
R-GDIP-T40
Number of Terminals
40
40
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-PRF-38535
MIL-STD-883
Supply Voltage-Max
5.25 V
5.25 V
Supply Voltage-Min
4.75 V
4.75 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
NMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
uPs/uCs/Peripheral ICs Type
MATH PROCESSOR, COPROCESSOR
MATH PROCESSOR, COPROCESSOR
Base Number Matches
2
1
Compare 5962-8854701QX with alternatives
Compare 5962-8944903QX with alternatives