5962-8854402LX
vs
HM1-65797M-2
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MICROSS COMPONENTS
|
ATMEL CORP
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP,
|
,
|
| Pin Count |
24
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A001.A.2.C
|
|
| HTS Code |
8542.32.00.41
|
|
| Access Time-Max |
45 ns
|
|
| Additional Feature |
TTL COMPATIBLE INPUTS/OUTPUTS; BATTERY BACKUP; LOW POWER STANDBY
|
|
| JESD-30 Code |
R-CDIP-T24
|
|
| JESD-609 Code |
e4
|
e0
|
| Memory Density |
262144 bit
|
|
| Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
| Memory Width |
1
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
24
|
|
| Number of Words |
262144 words
|
|
| Number of Words Code |
256000
|
|
| Operating Mode |
ASYNCHRONOUS
|
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-55 °C
|
|
| Organization |
256KX1
|
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
|
| Package Code |
DIP
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
IN-LINE
|
|
| Parallel/Serial |
PARALLEL
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-STD-883
|
|
| Seated Height-Max |
5.08 mm
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
NO
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
MILITARY
|
|
| Terminal Finish |
PALLADIUM GOLD
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
|
| Width |
7.62 mm
|
|
| Base Number Matches |
6
|
2
|
| Pbfree Code |
|
No
|
| Rohs Code |
|
No
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare 5962-8854402LX with alternatives
Compare HM1-65797M-2 with alternatives