5962-8854402LA
vs
CY7C197N-45PXC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
AUSTIN SEMICONDUCTOR INC
ROCHESTER ELECTRONICS LLC
Package Description
DIP, DIP24,.3
0.300 INCH, LEAD FREE, PLASTIC, DIP-24
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.41
Access Time-Max
45 ns
45 ns
I/O Type
SEPARATE
JESD-30 Code
R-CDIP-T24
R-PDIP-T24
JESD-609 Code
e0
e3
Memory Density
262144 bit
262144 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
1
1
Number of Functions
1
1
Number of Terminals
24
24
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Organization
256KX1
256KX1
Output Characteristics
3-STATE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP24,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
COMMERCIAL
Screening Level
38535Q/M;38534H;883B
Seated Height-Max
5.08 mm
4.826 mm
Standby Current-Max
0.0009 A
Standby Voltage-Min
2 V
Supply Current-Max
0.1 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
TIN LEAD
TIN
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
4
2
Pbfree Code
Rohs Code
Part Package Code
DIP
Pin Count
24
Length
31.75 mm
Moisture Sensitivity Level
NOT SPECIFIED
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
20
Compare 5962-8854402LA with alternatives