5962-8852515XX
vs
5962-8852515XA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SEEQ TECHNOLOGY INC
TELEDYNE E2V (UK) LTD
Part Package Code
DIP
DIP
Package Description
DIP,
DIP,
Pin Count
28
28
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
150 ns
150 ns
Additional Feature
AUTOMATIC WRITE
AUTOMATIC WRITE
JESD-30 Code
R-GDIP-T28
R-GDIP-T28
Length
37.215 mm
37.215 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
32KX8
32KX8
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
225
Programming Voltage
5 V
5 V
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883 Class B
38535Q/M;38534H;883B
Seated Height-Max
5.72 mm
5.72 mm
Supply Current-Max
0.08 mA
0.08 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
15.24 mm
15.24 mm
Write Cycle Time-Max (tWC)
3 ms
3 ms
Base Number Matches
4
3
Pbfree Code
Rohs Code
JESD-609 Code
e0
Terminal Finish
TIN LEAD
Compare 5962-8852515XX with alternatives
Compare 5962-8852515XA with alternatives