5962-8852510YX
vs
X28256EI
feature comparison
All Stats
Differences Only
Pbfree Code
No
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ATMEL CORP
XICOR INC
Part Package Code
QFJ
Package Description
HQCCN,
CERAMIC, LCC-32
Pin Count
32
Reach Compliance Code
compliant
unknown
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.51
Access Time-Max
300 ns
300 ns
Additional Feature
AUTOMATIC WRITE
JESD-30 Code
R-CQCC-N32
R-CQCC-N32
JESD-609 Code
e0
e0
Length
13.97 mm
13.97 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Organization
32KX8
32KX8
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
HQCCN
QCCN
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER, HEAT SINK/SLUG
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
5 V
5 V
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
Seated Height-Max
2.54 mm
3.048 mm
Supply Current-Max
0.05 mA
0.12 mA
Supply Voltage-Max (Vsup)
5.5 V
5.25 V
Supply Voltage-Min (Vsup)
4.5 V
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
NMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Width
11.43 mm
11.43 mm
Write Cycle Time-Max (tWC)
10 ms
Base Number Matches
4
1
Command User Interface
NO
Data Polling
YES
Output Characteristics
3-STATE
Package Equivalence Code
LCC32,.45X.55
Page Size
64 words
Toggle Bit
NO
Compare 5962-8852510YX with alternatives
Compare X28256EI with alternatives