5962-8851804LA vs 5962-8851807LA feature comparison

5962-8851804LA Cypress Semiconductor

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5962-8851807LA QP Semiconductor

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP QP SEMICONDUCTOR INC
Part Package Code DIP
Package Description DIP, DIP24,.3 DIP,
Pin Count 24
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 20 ns
I/O Type COMMON
JESD-30 Code R-GDIP-T24 R-GDIP-T24
JESD-609 Code e0 e0
Length 31.877 mm 31.877 mm
Memory Density 4096 bit 4096 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 512 words 512 words
Number of Words Code 512 512
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 512X8 512X8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP24,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 12.5 V
Qualification Status Not Qualified Not Qualified
Screening Level 38535Q/M;38534H;883B
Seated Height-Max 5.08 mm 5.08 mm
Standby Current-Max 0.12 A
Supply Current-Max 0.12 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 3 3

Compare 5962-8851804LA with alternatives

Compare 5962-8851807LA with alternatives