5962-8779103EA
vs
72401L35DGB
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
SRI INTERNATIONAL
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP, DIP16,.3
|
DIP-16
|
| Pin Count |
16
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.71
|
8542.32.00.71
|
| Access Time-Max |
65 ns
|
|
| Clock Frequency-Max (fCLK) |
10 MHz
|
35 MHz
|
| Cycle Time |
100 ns
|
|
| JESD-30 Code |
R-GDIP-T16
|
R-CDIP-T16
|
| Length |
19.431 mm
|
|
| Memory Density |
256 bit
|
256 bit
|
| Memory IC Type |
OTHER FIFO
|
OTHER FIFO
|
| Memory Width |
4
|
4
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Number of Words |
64 words
|
64 words
|
| Number of Words Code |
64
|
64
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Organization |
64X4
|
64X4
|
| Output Enable |
NO
|
NO
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP16,.3
|
DIP16,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Qualified
|
Not Qualified
|
| Screening Level |
38535Q/M;38534H;883B
|
MIL-STD-883 Class B
|
| Seated Height-Max |
5.08 mm
|
|
| Supply Current-Max |
0.18 mA
|
0.045 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
TTL
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare 5962-8779103EA with alternatives
Compare 72401L35DGB with alternatives