5962-8778802EA
vs
63S140N
feature comparison
Part Life Cycle Code |
Obsolete
|
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
|
Part Package Code |
DIP
|
|
Package Description |
DIP,
|
|
Pin Count |
16
|
|
Reach Compliance Code |
unknown
|
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.32.00.71
|
|
Access Time-Max |
40 ns
|
|
JESD-30 Code |
R-GDIP-T16
|
|
JESD-609 Code |
e0
|
|
Memory Density |
1024 bit
|
|
Memory IC Type |
OTP ROM
|
|
Memory Width |
4
|
|
Number of Functions |
1
|
|
Number of Terminals |
16
|
|
Number of Words |
256 words
|
|
Number of Words Code |
256
|
|
Operating Mode |
ASYNCHRONOUS
|
|
Operating Temperature-Max |
125 °C
|
|
Operating Temperature-Min |
-55 °C
|
|
Organization |
256X4
|
|
Package Body Material |
CERAMIC, GLASS-SEALED
|
|
Package Code |
DIP
|
|
Package Shape |
RECTANGULAR
|
|
Package Style |
IN-LINE
|
|
Parallel/Serial |
PARALLEL
|
|
Qualification Status |
Not Qualified
|
|
Screening Level |
MIL-STD-883
|
|
Supply Voltage-Max (Vsup) |
5.5 V
|
|
Supply Voltage-Min (Vsup) |
4.5 V
|
|
Supply Voltage-Nom (Vsup) |
5 V
|
|
Surface Mount |
NO
|
|
Technology |
BIPOLAR
|
|
Temperature Grade |
MILITARY
|
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
THROUGH-HOLE
|
|
Terminal Position |
DUAL
|
|
Base Number Matches |
6
|
|
|
|
|
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