5962-8775601RA vs MC74AC273NG feature comparison

5962-8775601RA Defense Logistics Agency

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MC74AC273NG onsemi

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer DEFENSE LOGISTICS AGENCY ON SEMICONDUCTOR
Package Description CERAMIC, DIP-20 DIP, DIP20,.3
Reach Compliance Code unknown unknown
Family AC AC
JESD-30 Code R-GDIP-T20 R-PDIP-T20
JESD-609 Code e0 e3
Length 24.51 mm 26.415 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 8 8
Number of Functions 1 1
Number of Terminals 20 20
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 16 ns 14.5 ns
Qualification Status Qualified Not Qualified
Screening Level MIL-STD-883
Seated Height-Max 5.08 mm 4.57 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 3 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD Tin (Sn)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 7.62 mm 7.62 mm
fmax-Min 90 MHz 125 MHz
Base Number Matches 8 2
Pbfree Code Yes
Rohs Code Yes
Part Package Code DIP
Pin Count 20
HTS Code 8542.39.00.01
Load Capacitance (CL) 50 pF
Max Frequency@Nom-Sup 75000000 Hz
Max I(ol) 0.012 A
Package Equivalence Code DIP20,.3
Packing Method RAIL
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40

Compare 5962-8775601RA with alternatives

Compare MC74AC273NG with alternatives