5962-87756012X
vs
TC74HC77AF(TP1)
feature comparison
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
QP SEMICONDUCTOR INC
|
TOSHIBA CORP
|
Part Package Code |
QLCC
|
SOIC
|
Package Description |
QCCN,
|
SOP,
|
Pin Count |
20
|
14
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
|
Family |
AC
|
HC/UH
|
JESD-30 Code |
S-CQCC-N20
|
R-PDSO-G14
|
Length |
8.89 mm
|
10.3 mm
|
Logic IC Type |
D FLIP-FLOP
|
D LATCH
|
Number of Bits |
8
|
2
|
Number of Functions |
1
|
2
|
Number of Terminals |
20
|
14
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-55 °C
|
-40 °C
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
Package Code |
QCCN
|
SOP
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
CHIP CARRIER
|
SMALL OUTLINE
|
Propagation Delay (tpd) |
16 ns
|
25 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
MIL-STD-883
|
|
Seated Height-Max |
1.905 mm
|
1.9 mm
|
Supply Voltage-Max (Vsup) |
6 V
|
6 V
|
Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
Supply Voltage-Nom (Vsup) |
3 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
INDUSTRIAL
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
DUAL
|
Trigger Type |
POSITIVE EDGE
|
HIGH LEVEL
|
Width |
8.89 mm
|
5.3 mm
|
fmax-Min |
95 MHz
|
|
Base Number Matches |
3
|
1
|
Pbfree Code |
|
No
|
Rohs Code |
|
No
|
Load Capacitance (CL) |
|
50 pF
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare 5962-87756012X with alternatives
Compare TC74HC77AF(TP1) with alternatives