5962-8770801QA
vs
CY2910A-DMB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
CYPRESS SEMICONDUCTOR CORP
Part Package Code
DIP
DIP
Package Description
DIP,
0.600 INCH, CERDIP-40
Pin Count
40
40
Reach Compliance Code
unknown
compliant
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.31.00.01
8542.31.00.01
External Data Bus Width
12
12
JESD-30 Code
R-GDIP-T40
R-GDIP-T40
Number of Terminals
40
40
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
38535Q/M;38534H;883B
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
uPs/uCs/Peripheral ICs Type
BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER
BIT-SLICE PROCESSOR, MICROPROGRAM SEQUENCER
Base Number Matches
2
1
Rohs Code
Clock Frequency-Max
19.61 MHz
JESD-609 Code
e0
Length
52.451 mm
Package Equivalence Code
DIP40,.6
Seated Height-Max
5.715 mm
Supply Current-Max
170 mA
Terminal Finish
TIN LEAD
Terminal Pitch
2.54 mm
Width
15.24 mm
Compare 5962-8770801QA with alternatives
Compare CY2910A-DMB with alternatives