Findchips: Compare 5962-8767401PA vs LM360J

5962-8767401PA vs LM360J feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	No	No
Part Life Cycle Code	Obsolete	Obsolete
Ihs Manufacturer	NATIONAL SEMICONDUCTOR CORP	NATIONAL SEMICONDUCTOR CORP
Part Package Code	DIP	DIP
Package Description	DIP, DIP8,.3	DIP, DIP8,.3
Pin Count	8	8
Reach Compliance Code	unknown	unknown
ECCN Code	EAR99	EAR99
HTS Code	8542.39.00.01	8542.39.00.01
Amplifier Type	COMPARATOR	COMPARATOR
Average Bias Current-Max (IIB)	20 µA	20 µA
Bias Current-Max (IIB) @25C	0.00002 µA	20 µA
Input Offset Voltage-Max	5000 µV	5000 µV
JESD-30 Code	R-GDIP-T8	R-GDIP-T8
JESD-609 Code	e0	e0
Neg Supply Voltage Limit-Max	-8 V	-8 V
Neg Supply Voltage-Nom (Vsup)	-5 V	-5 V
Number of Functions	1	1
Number of Terminals	8	8
Operating Temperature-Max	125 °C	70 °C
Operating Temperature-Min	-55 °C
Package Body Material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED
Package Code	DIP	DIP
Package Equivalence Code	DIP8,.3	DIP8,.3
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	IN-LINE	IN-LINE
Qualification Status	Not Qualified	Not Qualified
Response Time-Nom	25 ns	13 ns
Screening Level	MIL-STD-883
Supply Current-Max	48 mA	32 mA
Supply Voltage Limit-Max	8 V	8 V
Supply Voltage-Nom (Vsup)	5 V	5 V
Surface Mount	NO	NO
Technology	BIPOLAR	BIPOLAR
Temperature Grade	MILITARY	COMMERCIAL
Terminal Finish	TIN LEAD	TIN LEAD
Terminal Form	THROUGH-HOLE	THROUGH-HOLE
Terminal Pitch	2.54 mm	2.54 mm
Terminal Position	DUAL	DUAL
Base Number Matches	1	2
Seated Height-Max		5.08 mm
Width		7.62 mm
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