5962-8764801XX vs M27C512-15F1E feature comparison

5962-8764801XX Micross Components

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M27C512-15F1E STMicroelectronics

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer MICROSS COMPONENTS STMICROELECTRONICS
Part Package Code DIP DIP
Package Description CERAMIC, DIP-28 ROHS COMPLIANT, CERAMIC, DIP-28
Pin Count 28 28
Reach Compliance Code compliant unknown
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.32.00.61 8542.32.00.61
Access Time-Max 150 ns 150 ns
JESD-30 Code R-GDIP-T28 R-GDIP-T28
Memory Density 524288 bit 524288 bit
Memory IC Type UVPROM UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 64KX8 64KX8
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP WDIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE, WINDOW
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883
Supply Current-Max 0.00002 mA 0.03 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 9 1
Rohs Code Yes
I/O Type COMMON
JESD-609 Code e3
Length 36.92 mm
Output Characteristics 3-STATE
Package Equivalence Code DIP28,.6
Seated Height-Max 5.72 mm
Standby Current-Max 0.0001 A
Terminal Finish MATTE TIN
Terminal Pitch 2.54 mm
Width 15.24 mm

Compare 5962-8764801XX with alternatives

Compare M27C512-15F1E with alternatives