5962-8755601RA vs 54ACT373DM-MLS feature comparison

5962-8755601RA QP Semiconductor

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54ACT373DM-MLS National Semiconductor Corporation

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer QP SEMICONDUCTOR INC NATIONAL SEMICONDUCTOR CORP
Part Package Code DIP
Package Description CERAMIC, DIP-20 CERAMIC, DIP-20
Pin Count 20
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01
Family ACT ACT
JESD-30 Code R-GDIP-T20 R-GDIP-T20
JESD-609 Code e0 e0
Length 24.51 mm 24.51 mm
Logic IC Type BUS DRIVER BUS DRIVER
Number of Bits 8 8
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 20 20
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 12.5 ns 11.5 ns
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 38535Q/M;38534H;883B
Seated Height-Max 5.08 mm 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
Rohs Code No
Load Capacitance (CL) 50 pF
Max I(ol) 0.024 A
Moisture Sensitivity Level 1
Package Equivalence Code DIP20,.3
Packing Method RAIL
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 12.5 ns
Time@Peak Reflow Temperature-Max (s) 40

Compare 5962-8755601RA with alternatives

Compare 54ACT373DM-MLS with alternatives