5962-8752002JA
vs
CA82C54-8CP
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEL CORP
TUNDRA SEMICONDUCTOR CORP
Part Package Code
DIP
Package Description
DIP,
PLASTIC, DIP-24
Pin Count
24
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
HTS Code
8542.39.00.01
Clock Frequency-Max
1 MHz
8 MHz
External Data Bus Width
8
8
Information Access Method
PARALLEL, DIRECT ADDRESS
PARALLEL, DIRECT ADDRESS
JESD-30 Code
R-GDIP-T24
R-PDIP-T24
JESD-609 Code
e0
e0
Number of Bits
16
16
Number of Terminals
24
24
Number of Timers
3
3
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
Supply Current-Max
160 mA
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
uPs/uCs/Peripheral ICs Type
TIMER, PROGRAMMABLE
TIMER, PROGRAMMABLE
Base Number Matches
2
3
Length
31.75 mm
Seated Height-Max
6.35 mm
Terminal Pitch
2.54 mm
Width
15.24 mm
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