5962-8751507JA
vs
5962-8751508JX
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
QP SEMICONDUCTOR INC
CYPRESS SEMICONDUCTOR CORP
Part Package Code
DIP
DIP
Package Description
DIP,
DIP, DIP24,.6
Pin Count
24
24
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.61
8542.32.00.61
Access Time-Max
35 ns
35 ns
JESD-30 Code
R-GDIP-T24
R-GDIP-T24
JESD-609 Code
e0
Memory Density
65536 bit
65536 bit
Memory IC Type
UVPROM
UVPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
24
24
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
8KX8
8KX8
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
MIL-STD-883
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
2
3
I/O Type
COMMON
Output Characteristics
3-STATE
Package Equivalence Code
DIP24,.6
Supply Current-Max
0.12 mA
Terminal Pitch
2.54 mm
Compare 5962-8751507JA with alternatives
Compare 5962-8751508JX with alternatives