5962-8751506LX vs 27HC641-55FA feature comparison

5962-8751506LX Cypress Semiconductor

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27HC641-55FA Philips Semiconductors

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP PHILIPS SEMICONDUCTORS
Part Package Code DIP
Package Description DIP, DIP-24
Pin Count 24
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.32.00.61 8542.32.00.61
Access Time-Max 55 ns 55 ns
JESD-30 Code R-GDIP-T24 R-XDIP-T24
Memory Density 65536 bit 65536 bit
Memory IC Type UVPROM
Memory Width 8 8
Number of Functions 1
Number of Terminals 24 24
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 8KX8 8KX8
Package Body Material CERAMIC, GLASS-SEALED CERAMIC
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883
Supply Current-Max 0.12 mA 0.11 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 3 2
Rohs Code No
I/O Type COMMON
JESD-609 Code e0
Output Characteristics 3-STATE
Package Equivalence Code DIP24,.6
Standby Current-Max 0.11 A
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Pitch 2.54 mm

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