5962-8751506LA
vs
27HC641-55FA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
PHILIPS SEMICONDUCTORS
Part Package Code
DIP
Package Description
WDIP, DIP24,.3
DIP-24
Pin Count
24
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
EAR99
HTS Code
8542.32.00.61
8542.32.00.61
Access Time-Max
55 ns
55 ns
Additional Feature
POWER SWITCHED PROM
I/O Type
COMMON
COMMON
JESD-30 Code
R-GDIP-T24
R-XDIP-T24
JESD-609 Code
e0
e0
Length
31.877 mm
Memory Density
65536 bit
65536 bit
Memory IC Type
UVPROM
Memory Width
8
8
Number of Functions
1
Number of Terminals
24
24
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Organization
8KX8
8KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC
Package Code
WDIP
DIP
Package Equivalence Code
DIP24,.3
DIP24,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE, WINDOW
IN-LINE
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
38535Q/M;38534H;883B
Seated Height-Max
5.08 mm
Supply Current-Max
0.12 mA
0.11 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
Base Number Matches
3
2
Rohs Code
Standby Current-Max
0.11 A
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