5962-8751503LA vs 27HC641L-70I/SJ feature comparison

5962-8751503LA QP Semiconductor

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27HC641L-70I/SJ Microchip Technology Inc

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer QP SEMICONDUCTOR INC MICROCHIP TECHNOLOGY INC
Package Description , 0.300 INCH, SKINNY, CERDIP-24
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.32.00.61 8542.32.00.61
Access Time-Max 70 ns 70 ns
JESD-30 Code R-GDIP-T24 R-GDIP-T24
JESD-609 Code e0 e0
Memory Density 65536 bit 65536 bit
Memory IC Type UVPROM UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Organization 8KX8 8KX8
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE, WINDOW
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
Part Package Code DIP
Pin Count 24
I/O Type COMMON
Output Characteristics 3-STATE
Package Code WDIP
Package Equivalence Code DIP24,.3
Standby Current-Max 0.0001 A
Supply Current-Max 0.121 mA
Terminal Pitch 2.54 mm

Compare 5962-8751503LA with alternatives

Compare 27HC641L-70I/SJ with alternatives