5962-8751407YA
vs
M38510/26007BXA
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
PYRAMID SEMICONDUCTOR CORP
SEEQ TECHNOLOGY INC
Part Package Code
QFJ
DIP
Package Description
CERAMIC, LCC-32
DIP,
Pin Count
32
28
Reach Compliance Code
compliant
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
300 ns
350 ns
Additional Feature
AUTOMATIC WRITE
Command User Interface
NO
Data Polling
YES
Endurance
10000 Write/Erase Cycles
JESD-30 Code
R-CQCC-N32
R-XDIP-T28
JESD-609 Code
e0
Length
13.95 mm
Memory Density
65536 bit
65536 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
28
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
8KX8
8KX8
Package Body Material
CERAMIC, METAL-SEALED COFIRED
UNSPECIFIED
Package Code
QCCN
DIP
Package Equivalence Code
LCC32,.45X.55
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
IN-LINE
Page Size
32 words
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
5 V
5 V
Qualification Status
Not Qualified
Not Qualified
Screening Level
38535Q/M;38534H;883B
MIL-M-38510 Class B
Seated Height-Max
2.54 mm
Standby Current-Max
0.00025 A
Supply Current-Max
0.08 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
NO LEAD
THROUGH-HOLE
Terminal Pitch
1.27 mm
Terminal Position
QUAD
DUAL
Toggle Bit
YES
Width
11.4 mm
Write Cycle Time-Max (tWC)
2 ms
10 ms
Base Number Matches
4
1
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