5962-8751405XB vs KM28C64-25 feature comparison

5962-8751405XB Xicor Inc

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KM28C64-25 Samsung Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XICOR INC SAMSUNG SEMICONDUCTOR INC
Reach Compliance Code unknown unknown
Access Time-Max 250 ns 250 ns
JESD-30 Code R-GDIP-T28 R-PDIP-T28
JESD-609 Code e0
Memory Density 65536 bit 65536 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 8KX8 8KX8
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 5 V 5 V
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883
Seated Height-Max 5.9 mm 5.59 mm
Supply Current-Max 0.06 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
Write Cycle Time-Max (tWC) 10 ms
Base Number Matches 1 1
Part Package Code DIP
Package Description DIP,
Pin Count 28
ECCN Code EAR99
HTS Code 8542.32.00.51
Additional Feature AUTOMATIC WRITE; 100000 ERASE/WRITE CYCLES; DATA RETENTION = 10 YEARS
Data Retention Time-Min 10
Output Characteristics 3-STATE

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Compare KM28C64-25 with alternatives