5962-8751201FX
vs
5962-87505012A
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code
DFP
Package Description
DFP,
QCCN, LCC20,.35SQ
Pin Count
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
Family
10H
JESD-30 Code
R-GDFP-F16
S-XQCC-N20
Length
9.65 mm
Logic IC Type
D FLIP-FLOP
J-K FLIP-FLOP
Number of Bits
6
Number of Functions
1
2
Number of Terminals
16
20
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Characteristics
OPEN-EMITTER
Output Polarity
TRUE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC
Package Code
DFP
QCCN
Package Shape
RECTANGULAR
SQUARE
Package Style
FLATPACK
CHIP CARRIER
Propagation Delay (tpd)
3 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.15 mm
Surface Mount
YES
YES
Technology
ECL
ECL
Temperature Grade
MILITARY
MILITARY
Terminal Form
FLAT
NO LEAD
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
QUAD
Trigger Type
POSITIVE EDGE
MASTER-SLAVE
Width
6.415 mm
fmax-Min
250 MHz
Base Number Matches
2
3
Rohs Code
JESD-609 Code
e0
Package Equivalence Code
LCC20,.35SQ
Screening Level
38535Q/M;38534H;883B
Terminal Finish
Tin/Lead (Sn/Pb)
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