5962-8687514YC vs 5962-8687511XX feature comparison

5962-8687514YC Temic Semiconductors

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5962-8687511XX Temic Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEMIC SEMICONDUCTORS TEMIC SEMICONDUCTORS
Reach Compliance Code unknown unknown
Access Time-Max 70 ns 55 ns
Additional Feature INTERRUPT FLAG; AUTOMATIC POWER-DOWN
JESD-609 Code e4
Length 14.3002 mm
Memory Density 8192 bit 8192 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Words 1024 words 1024 words
Number of Words Code 1000 1000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 1KX8 1KX8
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
Package Code QCCN DIP
Package Style CHIP CARRIER IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 Class B MIL-STD-883
Seated Height-Max 3.048 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish GOLD
Terminal Form NO LEAD THROUGH-HOLE
Terminal Pitch 1.016 mm 2.54 mm
Terminal Position QUAD DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 14.3002 mm
Base Number Matches 1 1
Package Description CERAMIC, DIP-48
I/O Type COMMON
JESD-30 Code R-GDIP-T48
Number of Ports 2
Number of Terminals 48
Output Characteristics 3-STATE
Package Equivalence Code DIP48,.6
Package Shape RECTANGULAR
Standby Current-Max 0.03 A
Standby Voltage-Min 4.5 V
Supply Current-Max 0.23 mA

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