5962-8685924YX
vs
P4C188-35PC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
TEMIC SEMICONDUCTORS
PYRAMID SEMICONDUCTOR CORP
Reach Compliance Code
unknown
compliant
Access Time-Max
35 ns
35 ns
JESD-30 Code
R-GDIP-T22
R-PDIP-T22
Memory Density
65536 bit
65536 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
4
4
Number of Functions
1
1
Number of Terminals
22
22
Number of Words
16384 words
16384 words
Number of Words Code
16000
16000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Organization
16KX4
16KX4
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883 Class B
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
6
1
Pbfree Code
Rohs Code
Part Package Code
DIP
Package Description
0.300 INCH, PLASTIC, DIP-22
Pin Count
22
JESD-609 Code
e0
Length
29.337 mm
Seated Height-Max
5.334 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Terminal Finish
TIN LEAD
Terminal Pitch
2.54 mm
Width
7.62 mm
Compare 5962-8685924YX with alternatives
Compare P4C188-35PC with alternatives