5962-8685920TC vs 5962-8685919TX feature comparison

5962-8685920TC Micross Components

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5962-8685919TX Integrated Device Technology Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer AUSTIN SEMICONDUCTOR INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code DIP DIP
Package Description DIP, DIP,
Pin Count 22 22
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 55 ns 55 ns
JESD-30 Code R-XDIP-T22 R-XDIP-T22
JESD-609 Code e4 e0
Length 29.335 mm 29.335 mm
Memory Density 65536 bit 65536 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 4 4
Number of Functions 1 1
Number of Terminals 22 22
Number of Words 16384 words 16384 words
Number of Words Code 16000 16000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 16KX4 16KX4
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 MIL-STD-883
Seated Height-Max 5.08 mm 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish GOLD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 3 4

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