5962-8685912LX vs 5962-8685903LA feature comparison

5962-8685912LX Pyramid Semiconductor Corporation

Buy Now

5962-8685903LA Pyramid Semiconductor Corporation

Buy Now
Part Life Cycle Code Active Active
Ihs Manufacturer PYRAMID SEMICONDUCTOR CORP PYRAMID SEMICONDUCTOR CORP
Part Package Code DIP DIP
Package Description DIP, DIP, DIP24,.3
Pin Count 24 24
Reach Compliance Code compliant compliant
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 70 ns 70 ns
JESD-30 Code R-XDIP-T24 R-GDIP-T24
Memory Density 65536 bit 65536 bit
Memory IC Type STANDARD SRAM OTHER SRAM
Memory Width 4 4
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 16384 words 16384 words
Number of Words Code 16000 16000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 16KX4 16KX4
Package Body Material UNSPECIFIED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 MIL-STD-883
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 5 2
I/O Type COMMON
JESD-609 Code e0
Length 32.004 mm
Output Characteristics 3-STATE
Package Equivalence Code DIP24,.3
Seated Height-Max 5.08 mm
Standby Current-Max 0.025 A
Standby Voltage-Min 4.5 V
Supply Current-Max 0.14 mA
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm
Width 7.62 mm

Compare 5962-8685912LX with alternatives

Compare 5962-8685903LA with alternatives