5962-8685911LC vs 5962-8685909LA feature comparison

5962-8685911LC Pyramid Semiconductor Corporation

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5962-8685909LA Pyramid Semiconductor Corporation

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer PERFORMANCE SEMICONDUCTOR CORP PYRAMID SEMICONDUCTOR CORP
Package Description DIP, DIP, DIP24,.3
Reach Compliance Code unknown compliant
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 70 ns 35 ns
JESD-30 Code R-CDIP-T24 R-GDIP-T24
JESD-609 Code e4 e0
Length 30.48 mm 32.004 mm
Memory Density 65536 bit 65536 bit
Memory IC Type STANDARD SRAM OTHER SRAM
Memory Width 4 4
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 16384 words 16384 words
Number of Words Code 16000 16000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 16KX4 16KX4
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 MIL-STD-883
Seated Height-Max 4.013 mm 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish GOLD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 4 2
Part Package Code DIP
Pin Count 24
I/O Type COMMON
Output Characteristics 3-STATE
Package Equivalence Code DIP24,.3
Standby Current-Max 0.025 A
Standby Voltage-Min 4.5 V
Supply Current-Max 0.14 mA

Compare 5962-8685911LC with alternatives

Compare 5962-8685909LA with alternatives