5962-8685911LA
vs
5962-9461110HMC
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MICROSS COMPONENTS
|
WHITE MICROELECTRONICS
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP,
|
CO-FIRED CERAMIC, QFP-68
|
| Pin Count |
28
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
70 ns
|
17 ns
|
| JESD-30 Code |
R-CDIP-T24
|
S-CQFP-G68
|
| Memory Density |
65536 bit
|
16777216 bit
|
| Memory IC Type |
STANDARD SRAM
|
CACHE SRAM MODULE
|
| Memory Width |
4
|
32
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
68
|
| Number of Words |
16384 words
|
524288 words
|
| Number of Words Code |
16000
|
512000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Organization |
16KX4
|
512KX32
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
QFP
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
IN-LINE
|
FLATPACK
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-STD-883
|
MIL-PRF-38535
|
| Seated Height-Max |
5.08 mm
|
5.08 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Width |
7.62 mm
|
22.352 mm
|
| Base Number Matches |
1
|
1
|
| JESD-609 Code |
|
e4
|
| Length |
|
22.352 mm
|
| Terminal Finish |
|
GOLD
|
|
|
|
Compare 5962-8685911LA with alternatives
Compare 5962-9461110HMC with alternatives