5962-8685911LA vs 5962-8685909LA feature comparison

5962-8685911LA Micross Components

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5962-8685909LA Integrated Device Technology Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROSS COMPONENTS INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code DIP CDIP
Package Description DIP, 0.300 INCH, CERDIP-24
Pin Count 28 24
Reach Compliance Code compliant not_compliant
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 70 ns 35 ns
JESD-30 Code R-CDIP-T24 R-GDIP-T24
Memory Density 65536 bit 65536 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 4 4
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 16384 words 16384 words
Number of Words Code 16000 16000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 16KX4 16KX4
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 38535Q/M;38534H;883B
Seated Height-Max 5.08 mm 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
Manufacturer Package Code SD24
I/O Type COMMON
JESD-609 Code e0
Length 32.004 mm
Moisture Sensitivity Level 1
Number of Ports 1
Output Characteristics 3-STATE
Output Enable YES
Package Equivalence Code DIP24,.3
Peak Reflow Temperature (Cel) 240
Standby Current-Max 0.025 A
Standby Voltage-Min 4.5 V
Supply Current-Max 0.14 mA
Terminal Finish TIN LEAD

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Compare 5962-8685909LA with alternatives