5962-8685903LA vs 5962-8685911LC feature comparison

5962-8685903LA Pyramid Semiconductor Corporation

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5962-8685911LC Pyramid Semiconductor Corporation

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer PYRAMID SEMICONDUCTOR CORP PERFORMANCE SEMICONDUCTOR CORP
Part Package Code DIP
Package Description DIP, DIP24,.3 DIP,
Pin Count 24
Reach Compliance Code compliant unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 70 ns 70 ns
I/O Type COMMON
JESD-30 Code R-GDIP-T24 R-CDIP-T24
JESD-609 Code e0 e4
Length 32.004 mm 30.48 mm
Memory Density 65536 bit 65536 bit
Memory IC Type OTHER SRAM STANDARD SRAM
Memory Width 4 4
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 16384 words 16384 words
Number of Words Code 16000 16000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 16KX4 16KX4
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Equivalence Code DIP24,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 MIL-STD-883
Seated Height-Max 5.08 mm 4.013 mm
Standby Current-Max 0.025 A
Standby Voltage-Min 4.5 V
Supply Current-Max 0.14 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD GOLD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 2 4

Compare 5962-8685903LA with alternatives

Compare 5962-8685911LC with alternatives