5962-8685701RA
vs
MM74HCT688J
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
HARRIS SEMICONDUCTOR
NATIONAL SEMICONDUCTOR CORP
Package Description
DIP-20
DIP, DIP20,.3
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
CASCADABLE
CASCADABLE
Family
HCT
HCT
JESD-30 Code
R-GDIP-T20
R-GDIP-T20
JESD-609 Code
e0
e0
Logic IC Type
MAGNITUDE COMPARATOR
IDENTITY COMPARATOR
Number of Bits
8
8
Number of Functions
1
1
Number of Terminals
20
20
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Output Polarity
INVERTED
INVERTED
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
4
3
Pbfree Code
Rohs Code
Part Package Code
DIP
Pin Count
20
Length
24.51 mm
Load Capacitance (CL)
50 pF
Package Equivalence Code
DIP20,.3
Propagation Delay (tpd)
44 ns
Seated Height-Max
5.08 mm
Terminal Pitch
2.54 mm
Width
7.62 mm
Compare 5962-8685701RA with alternatives
Compare MM74HCT688J with alternatives