5962-8670511UA
vs
P4C169-25DC
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
PYRAMID SEMICONDUCTOR CORP
Part Package Code
LCC
DIP
Package Description
CERAMIC, QCC-20
0.300 INCH, HERMETIC SEALED, CERDIP-20
Pin Count
20
20
Manufacturer Package Code
LZ20
Reach Compliance Code
not_compliant
compliant
ECCN Code
3A001.A.2.C
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
25 ns
25 ns
I/O Type
COMMON
JESD-30 Code
S-CQCC-N20
R-GDIP-T20
JESD-609 Code
e0
e0
Memory Density
16384 bit
16384 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
4
4
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Terminals
20
20
Number of Words
4096 words
4096 words
Number of Words Code
4000
4000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Organization
4KX4
4KX4
Output Characteristics
3-STATE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, GLASS-SEALED
Package Code
QCCN
DIP
Package Equivalence Code
LCC20,.3X.43
Package Shape
SQUARE
RECTANGULAR
Package Style
CHIP CARRIER
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
Standby Voltage-Min
2.2 V
Supply Current-Max
0.12 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
NO LEAD
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
QUAD
DUAL
Base Number Matches
1
1
Additional Feature
FAST CHIP SELECT CONTROL
Length
25.146 mm
Seated Height-Max
5.08 mm
Width
7.62 mm
Compare 5962-8670511UA with alternatives
Compare P4C169-25DC with alternatives