5962-8670302FA
vs
M38510/20704BFX
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
NXP SEMICONDUCTORS
Part Package Code
DFP
DFP
Package Description
CERAMIC, FP-16
DFP,
Pin Count
16
16
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Factory Lead Time
4 Weeks
Access Time-Max
35 ns
JESD-30 Code
R-GDFP-F16
R-XDFP-F16
JESD-609 Code
e0
Memory Density
256 bit
2048 bit
Memory IC Type
OTP ROM
OTP ROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
16
16
Number of Words
32 words
32 words
Number of Words Code
32
256
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
32X8
256X8
Package Body Material
CERAMIC, GLASS-SEALED
UNSPECIFIED
Package Code
DFP
DFP
Package Equivalence Code
FL16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
Supply Current-Max
0.115 mA
0.13 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
BIPOLAR
BIPOLAR
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
FLAT
FLAT
Terminal Pitch
1.27 mm
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
Compare 5962-8670302FA with alternatives
Compare M38510/20704BFX with alternatives