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5962-8670302FA vs 5962-8670302FA feature comparison

5962-8670302FA AMD

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5962-8670302FA NXP Semiconductors

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC NXP SEMICONDUCTORS
Part Package Code DFP DFP
Package Description CERAMIC, FP-16 CERAMIC, FP-16
Pin Count 16 16
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Factory Lead Time 4 Weeks
Access Time-Max 35 ns 35 ns
JESD-30 Code R-GDFP-F16 R-GDFP-F16
JESD-609 Code e0 e0
Memory Density 256 bit 256 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 16 16
Number of Words 32 words 32 words
Number of Words Code 32 32
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 32X8 32X8
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DFP DFP
Package Equivalence Code FL16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK FLATPACK
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 MIL-STD-883
Supply Current-Max 0.115 mA 0.115 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology BIPOLAR BIPOLAR
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form FLAT FLAT
Terminal Pitch 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 1 1
Memory » OTP ROMs
Memory » OTP ROMs

Compare 5962-8670302FA with alternatives

Compare 5962-8670302FA with alternatives