5962-8606316YX
vs
5962-8606306YX
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MICROSS COMPONENTS
|
WAFERSCALE INTEGRATION INC
|
| Part Package Code |
QFJ
|
|
| Package Description |
QCCN,
|
WINDOWED, CERAMIC, LLCC-32
|
| Pin Count |
32
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
| HTS Code |
8542.32.00.61
|
8542.32.00.61
|
| Access Time-Max |
120 ns
|
120 ns
|
| JESD-30 Code |
R-CQCC-N32
|
R-CQCC-N32
|
| JESD-609 Code |
e4
|
|
| Memory Density |
262144 bit
|
262144 bit
|
| Memory IC Type |
UVPROM
|
UVPROM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
32
|
32
|
| Number of Words |
32768 words
|
32768 words
|
| Number of Words Code |
32000
|
32000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Organization |
32KX8
|
32KX8
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
QCCN
|
WQCCN
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER, WINDOW
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-STD-883
|
|
| Supply Current-Max |
0.025 mA
|
0.04 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
PALLADIUM GOLD
|
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Position |
QUAD
|
QUAD
|
| Base Number Matches |
1
|
1
|
| Length |
|
13.97 mm
|
| Seated Height-Max |
|
3.3 mm
|
| Terminal Pitch |
|
1.27 mm
|
| Width |
|
11.43 mm
|
|
|
|
Compare 5962-8606316YX with alternatives
Compare 5962-8606306YX with alternatives