5962-8606312QXX vs 5962-8606302XA feature comparison

5962-8606312QXX QP Semiconductor

Buy Now

5962-8606302XA AMD

Buy Now Datasheet
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer QP SEMICONDUCTOR INC ADVANCED MICRO DEVICES INC
Part Package Code DIP DIP
Package Description DIP, WINDOWED, CERAMIC, DIP-28
Pin Count 28 28
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.61 8542.32.00.61
Access Time-Max 250 ns 250 ns
JESD-30 Code R-GDIP-T28 R-GDIP-T28
JESD-609 Code e0 e0
Memory Density 262144 bit 262144 bit
Memory IC Type UVPROM UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 32KX8 32KX8
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP WDIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE, WINDOW
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-PRF-38535 Class Q 38535Q/M;38534H;883B
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb) - hot dipped
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 1 1
Rohs Code No
I/O Type COMMON
Length 37.1475 mm
Output Characteristics 3-STATE
Package Equivalence Code DIP28,.6
Programming Voltage 12.5 V
Seated Height-Max 5.588 mm
Standby Current-Max 0.0003 A
Supply Current-Max 0.05 mA
Terminal Pitch 2.54 mm
Width 15.24 mm

Compare 5962-8606312QXX with alternatives

Compare 5962-8606302XA with alternatives