5962-8606306XX
vs
AM27C256-120DCB
feature comparison
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
WAFERSCALE INTEGRATION INC
|
CYPRESS SEMICONDUCTOR CORP
|
Package Description |
0.600 INCH, WINDOWED, CERDIP-28
|
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
3A001.A.2.C
|
|
HTS Code |
8542.32.00.61
|
|
Access Time-Max |
120 ns
|
|
JESD-30 Code |
R-GDIP-T28
|
|
Length |
37.215 mm
|
|
Memory Density |
262144 bit
|
|
Memory IC Type |
UVPROM
|
|
Memory Width |
8
|
|
Number of Functions |
1
|
|
Number of Terminals |
28
|
|
Number of Words |
32768 words
|
|
Number of Words Code |
32000
|
|
Operating Mode |
ASYNCHRONOUS
|
|
Operating Temperature-Max |
125 °C
|
|
Operating Temperature-Min |
-55 °C
|
|
Organization |
32KX8
|
|
Package Body Material |
CERAMIC, GLASS-SEALED
|
|
Package Code |
WDIP
|
|
Package Shape |
RECTANGULAR
|
|
Package Style |
IN-LINE, WINDOW
|
|
Parallel/Serial |
PARALLEL
|
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
5.72 mm
|
|
Supply Current-Max |
0.04 mA
|
|
Supply Voltage-Max (Vsup) |
5.5 V
|
|
Supply Voltage-Min (Vsup) |
4.5 V
|
|
Supply Voltage-Nom (Vsup) |
5 V
|
|
Surface Mount |
NO
|
|
Technology |
CMOS
|
|
Temperature Grade |
MILITARY
|
|
Terminal Form |
THROUGH-HOLE
|
|
Terminal Pitch |
2.54 mm
|
|
Terminal Position |
DUAL
|
|
Width |
15.24 mm
|
|
Base Number Matches |
7
|
4
|
|
|
|
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