5962-8605304LX vs 5962-8605304LA feature comparison

5962-8605304LX AMD

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5962-8605304LA AMD

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC ADVANCED MICRO DEVICES INC
Part Package Code DIP DIP
Package Description DIP, 0.250 X 1.250 INCH, SKINNY, CERAMIC, DIP-24
Pin Count 24 24
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature VARIABLE PRODUCT TERMS; 10 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET VARIABLE PRODUCT TERMS; 10 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET
Clock Frequency-Max 31.2 MHz 31.2 MHz
JESD-30 Code R-GDIP-T24 R-GDIP-T24
Length 31.9405 mm 31.9405 mm
Number of Dedicated Inputs 11 11
Number of I/O Lines 10 10
Number of Terminals 24 24
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 11 DEDICATED INPUTS, 10 I/O 11 DEDICATED INPUTS, 10 I/O
Output Function MACROCELL MACROCELL
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Programmable Logic Type OT PLD OT PLD
Propagation Delay 20 ns 20 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.08 mm
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 2 3
Rohs Code No
Architecture PAL-TYPE
JESD-609 Code e0
Number of Inputs 22
Number of Outputs 10
Number of Product Terms 132
Package Equivalence Code DIP24,.3
Screening Level 38535Q/M;38534H;883B
Terminal Finish Tin/Lead (Sn/Pb) - hot dipped

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