5962-8601508XA vs IDT7187L70DBG feature comparison

5962-8601508XA Pyramid Semiconductor Corporation

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IDT7187L70DBG Integrated Device Technology Inc

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer PYRAMID SEMICONDUCTOR CORP INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code DIP DIP
Package Description DIP, DIP22,.3 0.300 INCH, CERAMIC, DIP-22
Pin Count 22 22
Reach Compliance Code compliant compliant
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 70 ns 70 ns
I/O Type SEPARATE
JESD-30 Code R-CDIP-T22 R-GDIP-T22
JESD-609 Code e0 e3
Length 27.94 mm 27.051 mm
Memory Density 65536 bit 65536 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 1 1
Number of Functions 1 1
Number of Terminals 22 22
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 64KX1 64KX1
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP22,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level 38535Q/M;38534H;883B MIL-STD-883 Class B
Seated Height-Max 4.521 mm 5.08 mm
Standby Current-Max 0.001 A
Standby Voltage-Min 2 V 2 V
Supply Current-Max 0.095 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD MATTE TIN
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 3 1
Pbfree Code Yes
Rohs Code Yes
Number of Ports 1
Output Enable NO

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Compare IDT7187L70DBG with alternatives