5962-8601506ZX
vs
P4C187-70LMB
feature comparison
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
PYRAMID SEMICONDUCTOR CORP
|
PYRAMID SEMICONDUCTOR CORP
|
Part Package Code |
QFN
|
LCC
|
Package Description |
QCCN,
|
0.290 X 0.490 INCH, LCC-22
|
Pin Count |
22
|
22
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
55 ns
|
70 ns
|
JESD-30 Code |
R-CQCC-N22
|
R-XQCC-N22
|
Length |
13.446 mm
|
12.446 mm
|
Memory Density |
65536 bit
|
65536 bit
|
Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
Memory Width |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
22
|
22
|
Number of Words |
65536 words
|
65536 words
|
Number of Words Code |
64000
|
64000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Organization |
64KX1
|
64KX1
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
UNSPECIFIED
|
Package Code |
QCCN
|
QCCN
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
MIL-STD-883
|
MIL-STD-883 Class B
|
Seated Height-Max |
1.981 mm
|
2.032 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
7.366 mm
|
7.366 mm
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
No
|
Rohs Code |
|
No
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Supply Current-Max |
|
0.145 mA
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare 5962-8601506ZX with alternatives
Compare P4C187-70LMB with alternatives