5962-8552501XX
vs
HM1-65642/883
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
ELECTRONIC DESIGNS INC
HARRIS SEMICONDUCTOR
Reach Compliance Code
unknown
unknown
Access Time-Max
70 ns
150 ns
JESD-609 Code
e0
e0
Length
35.56 mm
Memory Density
65536 bit
65536 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
8KX8
8KX8
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.937 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
Base Number Matches
2
3
Rohs Code
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.41
I/O Type
COMMON
JESD-30 Code
R-GDIP-T28
Number of Ports
1
Number of Terminals
28
Output Characteristics
3-STATE
Output Enable
YES
Package Equivalence Code
DIP28,.6
Package Shape
RECTANGULAR
Screening Level
38535Q/M;38534H;883B
Standby Current-Max
0.00015 A
Standby Voltage-Min
2 V
Supply Current-Max
0.048 mA
Surface Mount
NO
Terminal Form
THROUGH-HOLE
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