5962-8512401EX vs CD74HCT253M96G4 feature comparison

5962-8512401EX Intersil Corporation

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CD74HCT253M96G4 Texas Instruments

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer HARRIS SEMICONDUCTOR TEXAS INSTRUMENTS INC
Part Package Code DIP SOIC
Package Description DIP, SOP, SOP16,.25
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HCT
JESD-30 Code R-GDIP-T16 R-PDSO-G16
Logic IC Type MULTIPLEXER MULTIPLEXER
Number of Functions 4 2
Number of Inputs 2 4
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm 3.9 mm
Base Number Matches 2 1
Pbfree Code Yes
Rohs Code Yes
JESD-609 Code e4
Length 9.9 mm
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Package Equivalence Code SOP16,.25
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 57 ns
Propagation Delay (tpd) 57 ns
Terminal Finish NICKEL PALLADIUM GOLD
Time@Peak Reflow Temperature-Max (s) 30

Compare 5962-8512401EX with alternatives

Compare CD74HCT253M96G4 with alternatives