5962-8506402MQX vs 5962-8506402MQX feature comparison

5962-8506402MQX Temic Semiconductors

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5962-8506402MQX QP Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEMIC SEMICONDUCTORS QP SEMICONDUCTOR INC
Package Description CERAMIC, DIP-40 DIP,
Reach Compliance Code unknown unknown
Has ADC NO NO
Address Bus Width 16 24
Bit Size 8 8
Clock Frequency-Max 12 MHz 12 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 8 16
JESD-30 Code R-GDIP-T40 R-GDIP-T40
JESD-609 Code e0
Number of I/O Lines 32 32
Number of Terminals 40 40
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
PWM Channels NO YES
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
ROM Programmability MROM MROM
Screening Level MIL-STD-883 MIL-STD-883
Speed 12 MHz 12 MHz
Supply Voltage-Max 6 V 6 V
Supply Voltage-Min 4 V 4 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 1
Part Package Code DIP
Pin Count 40
ECCN Code 3A001.A.2.C
HTS Code 8542.31.00.01

Compare 5962-8506402MQX with alternatives

Compare 5962-8506402MQX with alternatives