5962-8506401MQX vs SC87C51CCF40 feature comparison

5962-8506401MQX NXP Semiconductors

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SC87C51CCF40 NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code DIP
Package Description DIP, DIP-40
Pin Count 40
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC NO NO
Address Bus Width 16 16
Bit Size 8 8
Clock Frequency-Max 12 MHz 12 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 8 8
JESD-30 Code R-GDIP-T40 R-GDIP-T40
JESD-609 Code e0
Number of I/O Lines 32 32
Number of Terminals 40 40
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
PWM Channels NO NO
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP WDIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE, WINDOW
Qualification Status Not Qualified Not Qualified
ROM Programmability MROM UVPROM
Screening Level MIL-STD-883
Speed 12 MHz 12 MHz
Supply Voltage-Max 6 V 5.5 V
Supply Voltage-Min 4 V 5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 1
Boundary Scan NO
Format FIXED POINT
Integrated Cache NO
Length 52.39 mm
Low Power Mode YES
Number of DMA Channels
Number of External Interrupts 2
Number of Serial I/Os 1
Number of Timers 2
On Chip Data RAM Width 8
On Chip Program ROM Width 8
RAM (words) 128
ROM (words) 4096
Seated Height-Max 5.72 mm
Supply Current-Max 20 mA
Terminal Pitch 2.54 mm
Width 15.24 mm

Compare 5962-8506401MQX with alternatives

Compare SC87C51CCF40 with alternatives