5962-8410001CA
vs
MC74HC393JDS
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
HARRIS SEMICONDUCTOR
MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code
DIP
Package Description
DIP,
DIP, DIP14,.3
Pin Count
14
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
Count Direction
UP
UP
Family
HC/UH
JESD-30 Code
R-GDIP-T14
R-XDIP-T14
JESD-609 Code
e0
e0
Load/Preset Input
YES
YES
Logic IC Type
BINARY COUNTER
BINARY COUNTER
Mode of Operation
ASYNCHRONOUS
ASYNCHRONOUS
Number of Bits
4
Number of Functions
2
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
6 V
Supply Voltage-Min (Vsup)
2 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Trigger Type
NEGATIVE EDGE
Width
7.62 mm
Base Number Matches
2
4
Rohs Code
Package Equivalence Code
DIP14,.3
Power Supplies
2/6 V
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